TD phone watch mainboard

TD Smartwatch Mainboard Key Specifications

Detailed Technical Explanation & Customer Benefits

1. 8-Layer 2-Stage HDI

• Technical Details:

  • Utilizes 2-stage laser drilling + stacked via technology for complex circuit routing.

  • Micro-blind/buried vias increase wiring density by 40%+ vs standard PCBs.

• Customer Benefits:
  ✅ Enables miniaturization for compact smartwatch designs.
  ✅ Enhances signal integrity with reduced high-frequency interference.

2. 0.8mm Ultra-Thin Board

• Process Control:

  • Ultra-thin core material (Core Thickness ≤0.1mm).

  • Precision lamination (±0.1mm tolerance control).

• Customer Benefits:
  ✅ Meets wearable devices’ lightweight requirements for comfort.
  ✅ Compatible with flexible battery layouts and micro-sensor integration.

3. Blue Solder Mask

• Functional Features:

  • Color Standard: Pantone 2945C Blue (industry-standard color matching).

  • Material: High-Resolution LPI (Liquid Photo-Imageable) Ink, 50μm minimum aperture precision.

• Customer Benefits:
  ✅ High contrast between blue mask and silver pads reduces SMT placement errors.
  ✅ Certified to IPC-SM-840E Class T for long-term reliability.

4. Dual Surface Treatment (ENIG + OSP)

Recommended Applications

Smartwatch/Wristband Main Control Boards
Miniature Medical Monitoring Devices
High-Precision IoT Modules