Detail
Smart Device Mainboard Module Specifications
Core Features at a Glance
| Parameter | Specification | Key Benefit |
|---|---|---|
| Layer Technology | 10-layer 2nd-order HDI | ✅ Supports ultra-compact, high-speed designs |
| Thickness | 1.0mm (±0.05mm) | ✅ Ideal balance of rigidity and space savings |
| Surface Finish | Half-hole ENIG + OSP | ✅ Combines reliability and cost efficiency |
| Special Process | Half-hole plating (PTH edge contacts) | ✅ Enables secure board-to-board connections |
Technical Advantages Explained
1. 10-Layer 2nd-Order HDI Architecture
Advanced Interconnect:
• Laser-drilled microvias (50μm) connect 1-2/2-3 and 9-10/8-9 layers
• Stacked copper-filled vias for power integrityPerformance Benefits:
60% higher component density vs standard 10-layer boards
Supports PCIe 4.0 (16Gbps) and LPDDR5 (6400Mbps) signals
2. 1.0mm Optimized Thickness
Precision Engineering:
• Uses ultra-low-loss materials (Dk=3.5 @10GHz)
• Thickness variation <±0.03mm across panelReal-World Advantages:
✅ Perfect for slim smart devices (<8mm chassis)
✅ 30% better heat dissipation vs 1.6mm boards
3. Half-Hole Plating + Dual Surface Finish
| Feature | Half-Hole ENIG | OSP Option |
|---|---|---|
| Process | Gold-plated PTH edge contacts | Organic solderability coating |
| Thickness | Ni 5μm + Au 0.1μm | 0.3μm organic layer |
| Best For | Board stacking connectors | High-volume SMT assembly |
| Durability | 500+ mating cycles | Cost-effective solution |
Performance Comparison
| Metric | This Module | Standard 10-Layer |
|---|---|---|
| Max Signal Speed | 16Gbps | 8Gbps |
| Thermal Resistance | 15°C/W | 22°C/W |
| Weight (100x80mm) | 18g | 25g |
Ideal Applications
▸ Premium smartphones/tablets
▸ AIoT edge computing devices
▸ High-end wearable health monitors
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