Sensor carrier board

Sensor Carrier Board Specifications

Product Variants Overview

We offer three specialized versions of double-layer BT material sensor carrier boards, each tailored for different application needs:

Technical Breakdown by Model

1. Model A (0.18mm ENIG) - For Precision Sensors

• Ultra-Thin Design: 0.18mm thickness enables flexible or compact sensor packaging.

• Immersion Gold (ENIG):

  • 5 microinches gold layer (0.127μm) for reliable wire bonding.

  • Nickel barrier prevents copper diffusion (3-5μm Ni layer).

• Advantages:
  ✅ Best signal integrity (low-loss BT material @ high frequencies).
  ✅ Ideal for medical/auto sensors requiring miniaturization.

2. Model B (0.25mm Aesthetic Finish) - For Consumer Devices

• "Beautiful" Back Process:

  • Laser-cleaned edges, no visible burrs or discoloration.

  • Matte black or custom-color solder mask options.

• Immersion Gold (ENIG): Same 5μ" gold layer as Model A.

• Advantages:
  ✅ Premium appearance for visible components (e.g., smartwatch sensors).
  ✅ Combines durability with aesthetics.

3. Model C (0.25mm Blue Solder Mask) - Cost-Effective

• Blue Solder Mask:

  • High-contrast for easy optical inspection.

  • Standard LPI (Liquid Photo-Imageable) ink.

• Advantages:
  ✅ Lower cost vs. ENIG finishes.
  ✅ Suits industrial sensors where appearance is secondary.

Material & Performance Highlights

• BT (Bismaleimide Triazine) Base:

  • Tg ≥180°C for thermal stability.

  • Dk ≤3.8 @1GHz for stable signal transmission.

• Common Benefits Across All Models:

  • RoHS & REACH compliant.

  • Support laser-drilled microvias (75μm minimum).

Selection Guide

Double-layer BT material 0.18mm immersion gold process

Double-layer BT material beautiful back process, immersion gold 5 microinches1

Double-layer BT material beautiful back process, immersion gold 5 microinches2

Double-layer BT material,   0.25mm blue ink,1

Double-layer BT material,   0.25mm blue ink2