Detail
Remote Control IC Substrate Specifications
Key Features at a Glance
| Parameter | Specification | Why This Matters |
|---|---|---|
| Material | 4-layer black core BT (Bismaleimide Triazine) | ✅ Superior heat resistance & signal integrity |
| Thickness | 0.33mm ultra-thin | ✅ Fits slim remote designs while maintaining durability |
| Surface Finish | Black core with smooth solder mask | ✅ Reduces EMI interference; professional appearance |
Technical Advantages Explained
1. 4-Layer Black Core BT Material
High-Performance Benefits:
Thermal Stability: Withstands up to 260°C during assembly (ideal for lead-free soldering).
Signal Clarity: Low dielectric loss (Dk ≤3.8 @1GHz) for reliable IR/RF signal transmission.
EMI Shielding: Black core blocks interference from nearby electronics (e.g., Wi-Fi routers).
2. 0.33mm Ultra-Thin Design
Precision Engineering:
Laser Microvias: Enable compact layouts for complex remote control circuits.
Rigid yet Lightweight: 30% thinner than standard substrates without sacrificing strength.
Customer Benefits:
Perfect for slim ergonomic remotes (e.g., smart home devices, AV systems).
Performance Comparison
| Metric | This Substrate | Standard FR-4 |
|---|---|---|
| Max Temp Resistance | 260°C | 130°C |
| Signal Loss @1GHz | 0.15dB/cm | 0.45dB/cm |
| Weight (per 10cm²) | 0.8g | 1.2g |
Ideal Applications
Smart TV/Set-Top Box Remotes
Voice Assistant RF Controllers
IoT Device Command Modules
Product 1
Product 2
Name*
*Country*
*Company
Email*
*Phone
Message
*
- Ultra-thin AnyLayer Interconnect Rigid-Flex PCB
- IC carrier board
- AI glasses design scheme