Detail
Intelligent Terminal Device Control Board Specifications
Key Parameters Overview
| Feature | Specification | Customer Value |
|---|---|---|
| Stackup | 10-layer 2nd-order HDI | ✅ Supports ultra-complex circuit designs |
| Thickness | 1.0mm (±0.05mm tolerance) | ✅ Optimizes structural strength & thermal performance |
| Surface Finish | ENIG + OSP dual-process options | ✅ Balances reliability and cost |
| Solder Mask | Matte black | ✅ Professional appearance + anti-glare |
Technical Deep Dive
1. 10-Layer 2nd-Order HDI Architecture
Breakthrough Design:
• Combines "2nd-order laser microvias + mechanical buried vias"
• Enables any-layer interconnection (L1-2/L2-3...L9-10)Performance Advantages:
45% higher routing density vs standard 10-layer boards
Supports 16Gbps high-speed signals (PCIe 4.0 compliant)
2. 1.0mm Precision Thickness
Material Innovation:
• Uses "low-loss Megtron6 substrate" + "ultra-thin 1080 glass fabric"
• Z-axis CTE ≤40ppm/°CTest Data:
Test Item This Board Industry Standard Thermal Resistance 12.8°C/W 18.5°C/W Flexural Strength 420 N/mm² 320 N/mm²
3. Dual Surface Treatment Options
| Process | ENIG | OSP |
|---|---|---|
| Thickness | Ni 5μm + Au 0.1μm | 0.3μm organic coating |
| Advantage | 500K insertion cycles | 25% cost reduction |
| Best For | Gold fingers/HS connectors | Standard SMT assembly |
4. Matte Black Solder Mask
Optical Properties:
• Gloss ≤20GU (anti-reflective)
• Color ΔE≤1.5 (batch consistency)Functional Benefits:
Conceals circuit traces for premium aesthetics
IPC-SM-840E Class III certified
Recommended Applications
▸ Industrial-grade intelligent terminal control systems
▸ High-end medical equipment mainboards
▸ Autonomous vehicle computing units
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