Control Chip Substrate Key Specifications
| Parameter | Technical Specification |
|---|---|
| Layer Structure | 4-layer Black Core BT Material Build-up |
| Finished Thickness | 0.33mm Ultra-Slim Design |
Technical Details & Customer Benefits
1. 4-Layer Black Core BT Material
Material Composition:
BT (Bismaleimide Triazine) Resin with blackened core for EMI shielding and light-blocking properties.
Glass transition temperature (Tg ≥180°C) for high-temperature stability.
Customer Benefits:
✅ Low Signal Loss: Dk (Dielectric Constant) ≤3.8 @10GHz, ideal for high-frequency control circuits.
✅ EMI Suppression: Black core reduces electromagnetic interference by 25% vs standard FR-4.
✅ Aesthetic Integration: Matte black finish blends seamlessly with compact chip packaging.
2. 0.33mm Ultra-Slim Thickness
Process Precision:
Laser-drilled microvias (75μm diameter) enable slim multi-layer stacking.
Total thickness variation (TTV ≤0.02mm) across the substrate.
Customer Benefits:
✅ Space Optimization: Saves 40% vertical space compared to 0.6mm substrates.
✅ Flexural Strength: Passes 5,000-cycle bend test (R=5mm) for flexible hybrid electronics (FHE).
Performance Comparison
| Feature | This Substrate | Standard FR-4 |
|---|---|---|
| Thickness | 0.33mm | 0.6-1.0mm |
| High-Frequency Loss | 0.12dB/cm @10GHz | 0.35dB/cm @10GHz |
| Thermal Conductivity | 0.65W/mK | 0.3W/mK |
Recommended Applications
Precision motor control modules
IoT sensor hub PCBs
Automotive ECU (Electronic Control Unit) micro-substrates
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