Detail
Connector Mainboard Specifications
Key Features at a Glance
| Parameter | Specification | Why This Matters |
|---|---|---|
| Layer Technology | 4-layer Any-layer HDI | ✅ Enables ultra-flexible circuit routing |
| Thickness | 0.35mm ultra-thin | ✅ Perfect for compact connector designs |
| Surface Finish | Dual-option: ENIG (Gold) or OSP | ✅ Choose between premium durability or cost efficiency |
Technical Advantages Explained
1. 4-Layer Any-layer HDI
Breakthrough Design:
Laser-drilled microvias can connect any two adjacent layers (e.g., L1-L2, L3-L4, L2-L3)
50μm microvias enable 30% higher component density vs traditional 4-layer boards
Customer Benefits:
✅ Eliminates sequential lamination requirements
✅ Supports high-speed signals up to 12Gbps (USB4/Thunderbolt compatible)
2. 0.35mm Precision Thickness
Engineering Excellence:
Uses ultra-low profile dielectrics (25μm core)
Total thickness variation <±0.02mm across panel
Real-World Advantages:
✅ Fits 0.5mm pitch board-to-board connectors
✅ Weighs 40% less than standard 0.8mm boards
3. Smart Surface Finish Options
| Option | ENIG (Gold Plating) | OSP (Organic Coating) |
|---|---|---|
| Best For | High-reliability applications | Cost-sensitive projects |
| Thickness | Ni 3-5μm + Au 0.05μm | 0.2-0.5μm organic layer |
| Shelf Life | 18 months | 6 months |
| Ideal Use | Gold finger contacts | High-volume SMT |
Performance Comparison
| Feature | This Mainboard | Standard 4-Layer |
|---|---|---|
| Max Signal Speed | 12Gbps | 6Gbps |
| Weight (10x10cm) | 2.8g | 4.7g |
| Thermal Cycles | 3,000 (-55↔125°C) | 1,500 (-40↔105°C) |
Recommended Applications
High-speed I/O connectors (USB4, HDMI 2.1)
Miniature board-to-board interconnects
Industrial waterproof connectors
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