Detail
Communication Equipment Module Board Specifications
Core Parameters Overview
| Parameter Category | Technical Specification |
|---|---|
| Layer Architecture | 10-layer 2nd order High Density Interconnection (HDI) |
| Thickness | 0.8mm (±0.05mm tolerance) |
| Surface Finish | ENIG (Immersion Gold) + OSP (Organic Solderability Preservative) Dual Options |
| Solder Mask | Blue High-Resolution LPI (Liquid Photo-Imageable) Ink |
Technical Highlights
1. 10-Layer 2nd Order HDI Structure
Technology Implementation:
2nd order laser blind vias: Interconnects 1-2/2-3 & 9-10/8-9 layers + 1-3 buried vias
Any-layer interconnection density: 40/40μm line width/spacing
Customer Benefits:
✅ 60% higher routing density vs standard PCBs, supports 5G mmWave antenna array design
✅ IPC-6012 Class 3 certified for base station operation (-40℃~+125℃)
2. 0.8mm Precision Thickness Control
Key Processes:
Ultra-thin 1080 glass fabric (single layer 0.075mm)
Lamination pressure ±2% closed-loop control, TTV≤0.03mm
Performance Comparison:
Metric This Board Standard FR4 Thermal Conductivity 0.68W/mK 0.3W/mK 10GHz Signal Loss 0.22dB/cm 0.65dB/cm
3. Dual Surface Treatment Options
| Process | ENIG (Immersion Gold) | OSP |
|---|---|---|
| Thickness | Ni 3-5μm + Au 0.05-0.1μm | Organic coating 0.2-0.5μm |
| Best For | High-frequency connectors/BGA soldering | Cost-effective SMT mass production |
| Shelf Life | 18 months (40℃/60%RH) | 6 months (N2 packaging required) |
Recommended Applications
5G base station AAU (Active Antenna Unit)
mmWave radar signal processing modules
High-end router backplane interconnection systems
Name*
*Country*
*Company
Email*
*Phone
Message
*
- Ultra-thin AnyLayer Interconnect Rigid-Flex PCB
- IC carrier board
- AI glasses design scheme