CPU chip carrier board

CPU Chip Carrier Board Key Specifications

Technical Details & Customer Benefits

1. 4-Layer BT Material Structure

• Material Properties:

  • Bismaleimide Triazine (BT) Resin: High thermal stability (Tg ≥200°C) and low dielectric loss (Dk ≤3.7 @10GHz).

  • Black core material for EMI shielding and light-blocking in optoelectronic integration.

• Customer Benefits:
  ✅ High-Frequency Performance: Minimizes signal distortion for CPU clock speeds up to 5GHz.
  ✅ Thermal Resilience: Withstands reflow soldering at 260°C for 20+ cycles (IPC-6012 Class 3).

2. 0.38mm Ultra-Slim Thickness

• Precision Engineering:

  • Laser Microvias: 60μm diameter holes for dense interlayer connections.

  • Total Thickness Variation (TTV): ≤0.015mm across the board.

• Customer Benefits:
  ✅ Space-Saving: Reduces vertical profile by 45% vs 0.8mm carriers.
  ✅ Enhanced Heat Dissipation: 0.8W/mK thermal conductivity for efficient CPU cooling.

3. ENEPIG Surface Treatment

• Key Advantages:
  ✅ Wire Bonding Compatibility: Supports both Au and Cu wire bonding.
  ✅ Long Shelf Life: Maintains solderability for 12+ months in standard storage.

4. Critical Process Controls

• Ink Leveling:

  • LPI solder mask ensures ≤5μm surface unevenness for fine-pitch BGA/CSP assembly.

• Backside Processing:

  • Laser-marked fiducials with ±0.05mm alignment accuracy.

  • Optional backside EMI shielding (sputtered AlNi alloy).

Performance Comparison

Recommended Applications

High-performance CPU/GPU packaging substrates
Server-grade LGA (Land Grid Array) sockets
5G baseband processing modules

4 layers of BT material, finished product 0.38mm plate thickness

CPU Chip Carrier Board Specifications

Key Features

Technical Breakdown

1. 4-Layer BT Material

• Why It Matters for CPUs:

  • High-Temperature Resistance: Withstands reflow soldering (260°C+) without warping.

  • Low Signal Loss: Dk ≤3.7 @10GHz—critical for high-speed data transmission.

  • EMI Shielding: Black core reduces interference in multi-chip modules.

2. 0.38mm Ultra-Thin Design

• Precision Engineering:

  • Laser-drilled microvias (60μm) enable dense interconnects.

  • TTV (Total Thickness Variation) ≤±0.01mm for consistent performance.

• Customer Advantage:

  • Fits space-constrained designs (e.g., slim laptops, IoT edge devices).

3. Ink Leveling & Backside Finish

• Solder Mask Smoothing:

  • ≤5μm surface unevenness—ideal for 0.35mm-pitch BGA components.

• Aesthetic Backside:

  • Laser-marked logos/serial numbers; no residual flux or scratches.

Performance Comparison

Recommended Applications

• CPU/GPU substrate packaging

• High-performance computing (HPC) modules

• 5G mmWave antenna boards