AI Smart Glasses Mainboard Key Specifications
| Parameter | Technical Specification |
|---|---|
| Layer & Interconnect | 14-layer Any-layer High-Density Interconnect (Any-layer HDI) |
| Finished Thickness | 0.8mm Ultra-Thin Design |
| Surface Treatment | Immersion Gold (ENIG) + OSP (Organic Solderability Preservative) Dual Options |
Technical Details & Customer Benefits
1. 14-Layer Any-layer HDI
Technology Implementation:
Any-layer laser blind vias: Direct interconnection between any adjacent layers (e.g., Layer 1-2, 2-3, ..., 13-14).
Stacked via filling: Copper paste filling eliminates step differences, ensuring impedance variation <5%.
Customer Benefits:
✅ 30% higher space utilization vs traditional HDI, enabling ultra-compact frame designs.
✅ Supports 10Gbps+ high-speed data transmission (e.g., AR image processors to sensors).
2. 0.8mm Ultra-Thin Board
Process Assurance:
Reverse-Treated Foil (RTF) copper (surface roughness ≤1.5μm) minimizes signal loss.
Precision lamination: ±0.05mm thickness tolerance, warpage <0.7%.
Customer Benefits:
✅ Lightweight: Only 3.2g per board (50mm×30mm size).
✅ Flexibility: Passes 30,000 bend cycles (radius R=10mm), compatible with curved temple designs.
3. Dual Surface Treatment (ENIG + OSP)
| Treatment | ENIG (Immersion Gold) | OSP (Organic Solderability Preservative) |
|---|---|---|
| Applications | Fine-pitch BGA (0.35mm pitch), LGA connectors | 0402/0201 components, flexible circuit joints |
| Key Advantages | Ultra-flat surface (Ra≤0.1μm) for 5G mmWave antenna soldering | 18% cost reduction, no nickel ion migration risk |
| Recommended Zones | Core processor area | Peripheral circuitry |
Recommended Applications
AR/VR smart glasses mainboards
Miniature head-mounted displays (HMDs)
Biometric sensing modules (e.g., iris/eye-tracking)
FPCA for smart glasses temples
Smart glasses touchpad FPCA
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